Pace Technologies, SIC-2108-400, 8" 400 Grit Silicon Abrasive Grinding Paper (Plain Backed)
Bonded or coated abrasive Paper of SiC are designed so that the abrasive will have a large number of cutting points (negative abrasive rank angle). This is achieved by aligning the abrasive particles approximately normal to the backing. Note that coated abrasives are not quite coplanar, thus SiC Paper produce the maximum efficiency (cut rate, stock removal and minimal damage) because new abrasive is exposed as the old abrasive breaks down.
Plain-backed Paper are the least expensive, however, they require either a double sided adhesive or a paper holding ring. The disadvantage to using a paper holding ring is that the mounted specimen cannot track over the edge of the grinding paper. Thus the paper does not break down uniformly and thus can produce over grinding of the mount away from the sample. This artifact results in the polished mount exhibiting a crescent moon which can affect the edge of the specimen. This artifact has also been known as "mooning" or MRD (material removal differential).
| Unit of Measure | Pack of 100 pcs |
