Pace Technologies, WB-005LCS, 5" Dia-mond Wafering Blade (low concentration) with Corrosion Resistant Stainless Steel Core (1/2" Arbor)
Features:
- Stainless steel core for improved corrosion resistance
- Very affordable and economical
- High Quality Blade
Precision wafer cutting is most commonly accomplished with dia-mond wafering blades, however for some materials the use of cubic boron nitride (CBN) is the more effiicient wafering blade. In addition, optimal wafer cutting is accomplished by maximizing the abrasive concentration and abrasive size, as well as choosing the most appropriate cutting speed and load. The following table provides the recommended parameters for precision wafering sectioning.
Precision wafer cutting is used for sectioning very delicate samples or for sectioning a sample to a very precise location. Precision wafering saws typically have micrometers for precise alignment and positioning of the sample, and have variable loading and cutting speed control. Typical precision wafering saws range in speeds from 50-1500 rpm or 300-3000 rpm. Higher speeds saws are required for sectioning very hard materials such as ceramics, heat treated steels and minerals.
