Pace Technologies, SI2-100A-640, Siamat 2 0.02 Micron Low-Crystallizing Colloidal Silica Polishing Abrasive (5 gallons)
Colloidal silica is a very unique polishing suspension because it provides a chemical mechanical polishing (CMP) action for materials such as ceramics, composites and soft metals. Colloidal silica has particle size distribution between 0.05µm and 0.07µm and is stabilized at alkaline pH values (typically >9.5).
Ceramics and Minerals - At higher pH values, colloidal silica is held in nearly perfect suspension by the electrochemical repulsive forces of the fine particles themselves. This chemical balance electrochemically attacks the surface of a ceramic or mineral surface to form a thin reacted layer on the specimen surface. This reacted layer can then be removed via the mechanical action of the polishing cloth or another abrasive (e.g. dia-mond). Polishing rates and surface finishes are significantly better for ceramics and minerals as compared with straight mechanical abrasives such as dia-mond. Thus the highest removal rates and the most reliable action for removing both surface and subsurface damage on ceramics and minerals is via chemical mechanical polishing with colloidal silica.
Applications:
- Precision surface finishing abrasive for ceramics and glass
- Ideal as a CMP abrasive when used by itself or with dia-mond polishing abrasives
